HCL–Foxconn JV Breaks Ground at Jewar, Uttar Pradesh
India Chip — a joint venture between HCL and Foxconn Group — broke ground at YEIDA (Yamuna Expressway Industrial Development Authority) in Jewar, Uttar Pradesh in February 2026, marking the entry of North India into the semiconductor manufacturing map.
The groundbreaking ceremony for India Chip at YEIDA, Jewar was attended by PM Modi on February 21, 2026. The project is an ATMP/OSAT facility and represents the first major semiconductor manufacturing investment in Uttar Pradesh. Jewar is also the site of the upcoming Noida International Airport — giving the facility direct connectivity to export routes. HCL brings design capability; Foxconn brings large-scale assembly experience across its global semiconductor and electronics manufacturing network.
Jewar matters for the talent pipeline beyond Gujarat. UP's large engineering graduate base — IIT Roorkee, IIT Kanpur, MNNIT, and dozens of state engineering colleges — now has a direct semiconductor employment destination within the state. For institutions in Delhi-NCR and western UP, this is the planning signal. Programmes started now would graduate their first cohorts exactly when India Chip's Jewar facility approaches full scale. For Punjab — geographically the closest major engineering education state to Jewar — it's worth watching.