13 approved semiconductor projects. 7 states. ₹1.64 lakh crore committed. This is the map of who’s building India’s assembly, test and packaging layer — and what each facility actually does.
Three facilities reached commercial operation before mid-2026 — two private OSAT lines and India’s government R&D fab.
DRAM and NAND memory assembly and test. Wafers imported from Micron’s global fabs, packaged into modules and SSDs. ~500,000 sq ft cleanroom — one of the world’s largest single raised-floor assembly/test facilities. First client: Dell; ramping toward ASUS, Qualcomm and others.
India’s first full-service OSAT provider. JV: CG Power 92.3%, Renesas ~6.8%, Stars ~0.9%. G1 pilot at 0.5M units/day; full ramp targets ~15M units/day. Package range: QFN, QFP, FC BGA, FC CSP — legacy to advanced.
Subsidiary of Kaynes Technology. Shipped India’s first commercially manufactured multi-chip modules (IPM5, 17 dies) to Alpha & Omega Semiconductor in October 2025. Scaling toward ~6.3M chips/day. ISM-approved Sept 2024.
India’s only government IDM. Current node 180nm; ~1,000 wafers/month for ISRO, DRDO, defence and railways. Chips in Mangalyaan; VIKRAM-3201 and KALPANA-3201 processors (radiation-hardened, space-validated). ₹4,500 crore upgrade announced Nov 28, 2025 — 100× capacity target. Under MeitY since 2022-23.
The largest facilities are mid-build. Tata’s Assam ATMP plant is the biggest single manufacturing investment; Dholera is India’s first true logic fab.
India’s first indigenous greenfield assembly and test plant. Designed for up to 48M chips/day. Packaging: flip-chip, ISIP. Among India’s largest single manufacturing investments. ~15,000 direct + 11,000–13,000 indirect jobs projected. ISM-approved Feb 29, 2024.
India’s first commercial logic fab (front-end wafer fabrication). 28nm and above; 300mm wafers; ~50,000 wafers/month at scale. Technology partner: PSMC (Taiwan). Full ramp ~2028. This is the project that makes India a chip-making country, not just a chip-packaging country.
May 16, 2026 — ASML agreement: Tata Electronics signed a framework agreement with ASML, the Dutch company that manufactures every EUV lithography machine on earth, confirming equipment supply and technology support for the Dholera fab. Full breakdown →
OSAT JV for display driver chips and other ICs. 20,000 wafers/month input; 36M units/month output target. HCL brings domestic anchor; Foxconn brings ATMP operations experience from its global supply chain.
India’s oldest semiconductor company. Brownfield expansion adding +158.38M units/year, taking total to ~760M/year. Products: MOSFETs, IGBTs, Silicon Carbide (SiC) devices, Schottky diodes, transistors. First Indian SiC components manufacturer. Serves 35+ countries.
India’s first commercial Silicon Carbide compound semiconductor fab, with UK partner Clas-SiC Wafer Fab. 60,000 wafers/year + 96M packaging units/year. SiC is critical for India’s EV charging infrastructure and high-power industrial electronics.
CML: compound semiconductor/ATMP in Dholera — Mini/Micro-LED and GaN epitaxy on 6-inch wafers. SSPL: OSAT in Surat targeting 1,033M chips/year. The most recent ISM wave, expanding Gujarat’s position as India’s semiconductor centre of gravity.
Before the current build-out, India had three well-publicised failures under the first ISM application round — useful context for anyone evaluating the mission’s credibility.
$19.5B fab JV (Gujarat). Announced Sept 2022; Foxconn withdrew July 2023 citing “challenging gaps” and slow timelines. Vedanta continued independently.
~$3B fab with Tower Semiconductor as tech partner. Stalled when Intel acquired Tower; the acquisition fell through but the project lost momentum.
Singapore-based applicant (~$3B). Withdrew and halted its application. No public explanation confirmed.
Four projects, three in Sanand alone: Micron (operational), CG Power–Renesas (pilot live), Kaynes (operational), and Tata–PSMC fab (Dholera). Gujarat benefits from existing industrial infrastructure, DMIC corridor access, and strong state-level policy support.
Tata TSAT at Morigaon is India’s largest single ATMP investment (₹27,000 crore) and its biggest projected employer (~15,000 direct jobs). The North East semiconductor strategy centres on creating a talent base where one didn’t previously exist.
SCL (Mohali, 1984) is India’s oldest chip facility and CDIL (Mohali, 1964) is its oldest semiconductor company. Both are expanding. Punjab is the only state with two ISM-era investments — but neither is a new greenfield announcement; both are upgrades to 60-year-old infrastructure.
Odisha (SiCSem, 3D Glass Solutions), Andhra Pradesh (ASIP Technologies), Uttar Pradesh (HCL–Foxconn at Jewar), and Rajasthan (Sahasra Semiconductors, Bhiwadi) complete the seven-state spread, signalling ISM’s explicit multi-state distribution strategy.
The companies with operational or near-operational lines are recruiting for process engineers, equipment engineers, test engineers and operators. The biggest near-term hiring demand is at Tata TSAT (Assam) and Micron (Sanand) — both at scale-up stage.
Process, test and equipment engineers. Search “Micron Sanand” on LinkedIn and Micron careers.
Largest upcoming employer. Manufacturing, process and quality roles. Watch Tata Electronics careers.
Sanand OSAT. Package engineering and test roles. Search “CG Semi” on Naukri.
Sanand. Process and equipment engineering, multi-chip module production. Kaynes Technology careers portal.
Mohali. Discrete device manufacturing, test, process roles. CDIL careers and Naukri.
Government scientist/engineer posts via MeitY. Watch SCL official site and government job portals.
CG Power–Renesas–Stars (CG Semi), Sanand, launched its G1 pilot line on August 28, 2025, making it India’s first full-service OSAT. Kaynes Semicon (Sanand) became fully operational March 31, 2026.
No — it is an assembly and test (ATMP) facility. Micron imports finished wafers from its global fabs and packages them into DRAM modules and NAND SSDs at Sanand. India’s first logic fab is Tata–PSMC at Dholera.
Discrete power semiconductors — MOSFETs, IGBTs, Schottky diodes, transistors, and Silicon Carbide (SiC) devices. CDIL is India’s first and oldest semiconductor company (est. 1964) and the first to make SiC components.
~₹1.64 lakh crore (~$20 billion) across 13 approved projects as of mid-2026, supported by the India Semiconductor Mission’s ₹76,000 crore ($10B) corpus that co-funds up to 50% of project cost.
We advise institutions on real, plant-linked assembly, test & packaging programmes that place graduates at India’s new OSAT units.
