Sanand Is Now India's First Chip Packaging Cluster — Three Facilities Operational Within 12km
With CG Semi's inauguration on July 4, Sanand, Gujarat has three operational OSAT/ATMP facilities within a 12km radius — Micron (Feb 28), Kaynes (Mar 31), CG Semi (Jul 4) — India's first genuine semiconductor manufacturing cluster.
Micron ATMP (Feb 28, 2026): DRAM and NAND memory packaging, USD 2.75B. Hiring: memory test engineers, process technicians. Kaynes Semicon OSAT (Mar 31, 2026): 6.3 million chips/day at full capacity, IPM and power semiconductor focus. Hiring: wire bonding and encapsulation equipment engineers. CG Semi OSAT (Jul 4, 2026): ₹7,600 crore, QFN/QFP/FC-BGA/FC-CSP, automotive and 5G. G2 plant under construction — combined future capacity 15 million chips/day.
Gujarat total: six ISM-approved projects, USD 14.7 billion combined — Tata Electronics (Dholera fab), Micron, Kaynes, CG Semi, Suchi Semicon, Crystal Matrix. Gujarat was first state with a dedicated Semiconductor Policy and has moved fastest from approval to inauguration of any state in India.
A cluster changes workforce economics in ways a single facility does not. An institution within 200km of Sanand now has three confirmed live placement destinations with distinct packaging technology profiles — not three versions of the same job. A well-designed OSAT curriculum can place students across all three with a shared technical foundation and facility-specific modules in the final semester. The window to be the first institution to sign MoUs with all three Sanand facilities simultaneously — and design a programme around the cluster rather than one facility — is open right now and will not stay open long.